Three-dimensional triangle-based simulation of etching processes

被引:0
|
作者
Lenhart, O [1 ]
Bär, E [1 ]
机构
[1] Fraunhofer Inst Integrated Circuits, Device Technol Div, D-91058 Erlangen, Germany
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暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A software module for the three-dimensional simulation of etching processes has been developed. It works on multilayer structures given as triangulated surface meshes. The mesh is moved no-dewise according to rates which in this work have been determined from isotropic and anisotropic components. An important feature of the algorithm is the automatic detection of triple lines along mask edges and the refinement of triangles at these triple lines. This allows for the simulation of underetching. The capabilities of the algorithm are demonstrated by examples such as the simulation of glass etching for the fabrication of a phase shift mask for optical lithography and the etching of an STI trench structure.
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页码:127 / 130
页数:4
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