Full-wave electromagnetic modeling of interconnects with meshed ground planes

被引：0
|
作者：
Mathis, AW [1 ]
Peterson, AF [1 ]
机构：
[1] Georgia Inst Technol, Sch Elect & Comp Engn, Atlanta, GA 30332 USA
来源：
ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING | 1998年
关键词：
D O I：
10.1109/EPEP.1998.733917
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
An integral equation method for analyzing interconnects in the presence of meshed ground planes is presented. The integral equation is solved to produce the electric currents on the interconnect while the ground plane perforations are accounted by a numerical Green's function. Numerical results for a microstrip transmission line with a perforated ground plane are presented.
引用
收藏
页码：136 / 139
页数：4
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