SPRINT: A High-Performance, Energy-Efficient, and Scalable Chiplet-Based Accelerator With Photonic Interconnects for CNN Inference

被引:10
|
作者
Li, Yuan [1 ]
Louri, Ahmed [1 ]
Karanth, Avinash [2 ]
机构
[1] George Washington Univ, Dept Elect & Comp Engn, Washington, DC 20052 USA
[2] Ohio Univ, Sch Elect Engn & Comp Sci, Athens, OH 45701 USA
基金
美国国家科学基金会;
关键词
Photonics; Convolutional neural networks; Optical waveguides; Optical switches; Optical filters; Convolution; Optical network units; Convolution neural network; chiplet; accelerator; photonic interconnects; ON-CHIP; NETWORKS; CMOS; OPTIMIZATION; ARCHITECTURE; DESIGN;
D O I
10.1109/TPDS.2021.3139015
中图分类号
TP301 [理论、方法];
学科分类号
081202 ;
摘要
Chiplet-based convolution neural network (CNN) accelerators have emerged as a promising solution to provide substantial processing power and on-chip memory capacity for CNN inference. The performance of these accelerators is often limited by inter-chiplet metallic interconnects. Emerging technologies such as photonic interconnects can overcome the limitations of metallic interconnects due to several superior properties including high bandwidth density and distance-independent latency. However, implementing photonic interconnects in chiplet-based CNN accelerators is challenging and requires combined effort of network architectural optimization and CNN dataflow customization. In this article, we propose SPRINT, a chiplet-based CNN accelerator that consists of a global buffer and several accelerator chiplets. SPRINT introduces two novel designs: (1) a photonic inter-chiplet network that can adapt to specific communication patterns in CNN inference through wavelength allocation and waveguide reconfiguration, and (2) a CNN dataflow that can leverage the broadcasting capability of photonic interconnects while minimizing the costly electrical-to-optical and optical-to-electrical signal conversions. Simulations using multiple CNN models show that SPRINT achieves up to 76% and 68% reduction in execution time and energy consumption, respectively, as compared to other state-of-the-art chiplet-based architectures with either metallic or photonic interconnects.
引用
收藏
页码:2332 / 2345
页数:14
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