Computing in 3D

3D technologies offer significant potential to improve total performance and performance per unit of power. After exploiting TSV technologies for cost reduction and increasing memory bandwidth, the next frontier is to create sophisticated logic on logic solutions that promise further increases in performance/power beyond those attributable to memory interfaces alone. These include heterogenous integration for computing and exploitation of the high amounts of 3D interconnect available to reduce total interconnect power. Challenges include access for prototype quantities and the design of sophisticated static and dynamic thermal management methods and technologies, as well as test.