Frequency dependent plasma characteristics in a capacitively coupled 300mm wafer plasma processing chamber

被引:87
|
作者
Hebner, Gregory A.
Barnat, Edward V.
Miller, Paul A.
Paterson, Alex M.
Holland, John P.
机构
[1] Sandia Natl Labs, Albuquerque, NM 87185 USA
[2] Appl Mat Inc, Sunnyvale, CA 94086 USA
来源
PLASMA SOURCES SCIENCE & TECHNOLOGY | 2006年 / 15卷 / 04期
关键词
D O I
10.1088/0963-0252/15/4/035
中图分类号
O35 [流体力学]; O53 [等离子体物理学];
学科分类号
070204 ; 080103 ; 080704 ;
摘要
Argon plasma characteristics in a dual-frequency, capacitively coupled, 300 mm-wafer plasma processing system were investigated for rf drive frequencies between 10 and 190 MHz. We report spatial and frequency dependent changes in plasma parameters such as line-integrated electron density, ion saturation current, optical emission and argon metastable density. For the conditions investigated, the line-integrated electron density was a nonlinear function of drive frequency at constant rf power. In addition, the spatial distribution of the positive ions changed from uniform to peaked in the centre as the frequency was increased. Spatially resolved optical emission increased with frequency and the relative optical emission at several spectral lines depended on frequency. Argon metastable density and spatial distribution were not a strong function of drive frequency. Metastable temperature was approximately 400 K.
引用
收藏
页码:879 / 888
页数:10
相关论文
共 50 条
  • [1] Spatial and frequency dependence of plasma currents in a 300mm capacitively coupled plasma reactor
    Miller, Paul A.
    Barnat, Edward V.
    Hebner, Gregory A.
    Paterson, Alex M.
    Holland, John P.
    PLASMA SOURCES SCIENCE & TECHNOLOGY, 2006, 15 (04): : 889 - 899
  • [2] Equipment and process development on 300mm wafer plasma etch tools
    Mautz, KE
    PLASMA PROCESSING XII, 1998, 98 (04): : 242 - 253
  • [3] 300mm silicon crystal growth and wafer processing
    Tu, HL
    Zhou, QG
    Zhang, GH
    2004: 7TH INTERNATIONAL CONFERENCE ON SOLID-STATE AND INTEGRATED CIRCUITS TECHNOLOGY, VOLS 1- 3, PROCEEDINGS, 2004, : 2353 - 2355
  • [4] Magnetically enhanced dual frequency capacitively coupled plasma source for large-area wafer processing
    Wickramanayaka, S
    Nakagawa, Y
    JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 1998, 37 (11): : 6193 - 6198
  • [5] The reasonably good status of 300mm wafer-processing tools
    Irwin, JA
    SOLID STATE TECHNOLOGY, 2000, 43 (10) : 79 - +
  • [6] Comprehensive understanding of chamber conditioning effects on plasma characteristics in an advanced capacitively coupled plasma etcher
    Baek, Kye Hyun
    Lee, Eunwoo
    Klick, Michael
    Rothe, Ralf
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A, 2017, 35 (02):
  • [7] Plasma doping system for 200 and 300mm wafers
    Liebert, RB
    Walther, SR
    Felch, SB
    Fang, ZW
    Pedersen, BO
    Hacker, D
    2000 INTERNATIONAL CONFERENCE ON ION IMPLANTATION TECHNOLOGY, PROCEEDINGS, 2000, : 472 - 475
  • [8] Low-frequency dependence of plasma characteristics in dual-frequency capacitively coupled plasma sources
    Zhou, Yang
    Zhao, Kai
    Ma, Fang-Fang
    Liu, Yong-Xin
    Gao, Fei
    Schulze, Julian
    Wang, You-Nian
    APPLIED PHYSICS LETTERS, 2024, 124 (06)
  • [9] Velocity distribution of ions incident on a wafer in two frequency capacitively-coupled plasma
    Wakayama, G
    Nanbu, K
    RAREFIED GAS DYNAMICS, 2003, 663 : 1079 - 1086
  • [10] Effect of dust particle size on the plasma characteristics in a radio frequency capacitively coupled silane plasma
    Jia, Wen-Zhu
    Zhang, Quan-Zhi
    Wang, Xi-Feng
    Song, Yuan-Hong
    Zhang, Ying-Ying
    Wang, You-Nian
    JOURNAL OF PHYSICS D-APPLIED PHYSICS, 2019, 52 (01)