Profile simulation of SU-8 thick film resist

XP SU-8 3000 (hereinafter referred to as "SU-8") thick-film resist is a chemically amplified negative resist based on epoxy resin. Here, we report on the profile simulation for this resist. Profile simulation is an important technique for planning experiments. Thus, there have been many reports on simulation techniques. In particular, many studies have been conducted on chemically amplified positive resists, as they are major resist materials used in the IC industry. However, there have been few simulation studies concerning chemically amplified negative resists. Thus, we conducted studies on the two-stage PEB process for a chemically amplified negative resist and reported the results [1]. In this article, the process is modified from the previous two-stage PEB process to a single-stage PEB process, the effects of the crosslinking reaction are measured, and a simulation technique is studied.