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- [1] Combine Partial EBG Structure and Z-shape Power Bus for Noise Isolation in Multi-layer PCBs 2015 ASIA-PACIFIC INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY (APEMC), 2015, : 106 - 108
- [2] Multi-Mode Excitation by Interleaved EBG Structure for Suppression of Power/Ground Noise in Multi-Layer PCBs APPLIED COMPUTATIONAL ELECTROMAGNETICS SOCIETY JOURNAL, 2022, 37 (05): : 619 - 623
- [3] Effect of EBG structures for reducing noise in multi-layer PCBs for digital systems ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING, 2006, : 253 - +
- [6] Partial EBG Power Distribution Network using Remants of Signal Layers in Multi-layer PCB 2006 IEEE INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY, VOLS 1-3, PROCEEDINGS, 2006, : 43 - 46
- [7] Analysis of noise suppression techniques using embedded capacitor on split power bus in multi-layer package 2004 INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY, SYMPOSIUM RECORD 1-3, 2004, : 215 - 220
- [8] Modeling of gapped power bus structures for isolation using cavity modes 2003 IEEE SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY, SYMPOSIUM RECORD, VOLS 1 AND 2, 2003, : 10 - 15
- [9] Study on the power bus noise isolation using a SPICE compatible method EMC 2005: IEEE International Symposium on Electromagnetic Compatibility, Vols 1-3, Proceedings, 2005, : 438 - 441
- [10] Investigation of the effectiveness of DC power bus interplane capacitance in reducing radiated EMI from multi-layer PCBs. IEEE 1997 INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY - SYMPOSIUM RECORD, 1997, : 293 - 297