Preparation of HBWSL-1 Type Photosensitive Resin for Stereolithography and Study on the Accuracy of Its Fabricated Parts

HBWSL-1 type photosensitive resin for Stereolithography was prepared with bisphenol A type epoxy diacrylate (EA-612), polyethene glycol (200) diacrylate (PEGDA), ethoxylated trimethyolpropane triacrylate (EO(3)TMPTA), cycloaliphatic diepoxide (ERL-4221), polycaprolactone polyol(Polyol-0301), 1-hydroxycyclohexyl phenyl ketone (Irgacure184) and a mixture of triarylsulfonium hexafluoroantimonate salts (UVI-6976). The main parameters of the photosensitive resin were as follows: the penetration depth was 0.15mm, the critical exposure was 16.6mJ/cm(2), the viscosity at 30 degrees C was 215mPa.s, and the density at 30 degrees C was 1.13g/cm(3). With the photosensitive resin as the processing material, cuboid parts and double-cantilever parts were fabricated by using a stereolithography apparatus, and the dimension shrinkage factor and the curl factor were studied. The shrinkage factor was less than 1.00%, and the curl factor was less than 8.00%, which showed that the accuracy of the fabricated parts was high with the photosensitive resin for stereolithography.