Electrical characterizations of isotropic conductive adhesives (ICAs)

被引:6
|
作者
Shimada, Y [2 ]
Lu, DQ
Wong, CP
机构
[1] Georgia Inst Technol, Packaging Res Ctr, Atlanta, GA 30332 USA
[2] Georgia Inst Technol, Sch Mat Sci & Engn, Atlanta, GA 30332 USA
来源
JOURNAL OF ELECTRONICS MANUFACTURING | 2000年 / 10卷 / 02期
关键词
electrically conductive adhesives; electrical properties; four-point probe method; current density; contact resistance;
D O I
10.1142/S0960313100000083
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Isotropic conductive adhesives (ICAs) have been developed as an alternative for traditional tin/lead (Sn/Pb) solders for electronics interconnect applications. Low processing temperature, elimination of lead, no-flux, no-clean process and the simple processing are some of the advantages of using ICAs. However, compared to the mature soldering technology, conductive adhesive technology is still in its infancy, and as such, there are some limitations for current commercial ICAs. Besides the conductivity fatigue and poor impact strength, electrically conductive adhesives tend to have lower current carrying capability and higher contact resistance in comparison to the conventional Sn/Pb solder. This is mainly due to the difference in the electrical conductive mechanisms between ICAs and Sn/Pb solders. This study focuses on current capacity measurements and other electrical properties, such as inductance, capacitance and resistance with a LCR meter and a four-point probe both in the direct current (DC) and alternating current (AC) ranges of the ICAs.
引用
收藏
页码:97 / 103
页数:7
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