A rapid one-step process for fabrication of superhydrophobic surface by electrodeposition method

被引:146
|
作者
Chen, Zhi [1 ]
Hao, Limei [2 ]
Chen, Anqi [1 ]
Song, Qingjun [1 ]
Chen, Changle [1 ]
机构
[1] NW Polytech Univ, Dept Appl Phys, Xian 710129, Peoples R China
[2] Xian Univ Sci & Technol, Dept Appl Phys, Xian 710054, Peoples R China
基金
中国国家自然科学基金;
关键词
Superhydrophobic; Electrodeposition; Copper surfaces; Myristic acid; Contact angle; SUPER-HYDROPHOBIC SURFACES; SOLUTION-IMMERSION PROCESS; COPPER;
D O I
10.1016/j.electacta.2011.10.045
中图分类号
O646 [电化学、电解、磁化学];
学科分类号
081704 ;
摘要
Superhydrophobic surfaces are commonly prepared by a combination of low surface energy materials and micro/nano structures. In this work, a rapid one-step electrodepositing process is developed to fabricate superhydrophobic cathodic surface by copper plate in an electrolytic solution containing nickel chloride(NiCl2 center dot 6H(2)O), myristic acid and ethanol. Scanning electron microscopy (SEM) images, Fourier-transform infrared (FTIR) spectrometer, X-ray diffraction (XRD) and contact angle measurement have been performed to characterize the morphological features, chemical composition and superhydrophobicity property. The results demonstrate that the micro/nano scales cauliflower-like structure are composed of Ni crystals and Ni[CH3(CH2)(12)COO](2) crystals. The maximum contact angle is about 164 and rolling angle is less than 2 degrees. The needed electrolytic time is largely shortened to 1 min. This method is rapid, easy and effective, and it will have great prospects for industrial applications. (C) 2011 Elsevier Ltd. All rights reserved.
引用
收藏
页码:168 / 171
页数:4
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