Evaluation of microstructure, mechanical and thermal properties of SiC/SiC composites

被引:5
|
作者
Suyama, S
Kameda, T
Itoh, Y
机构
[1] Toshiba Co Ltd, Power & Ind Syst Res & Dev Ctr, Kawasaki Ku, Kawasaki, Kanagawa 2100862, Japan
[2] Toshiba Co Ltd, Power & Ind Syst Res & Dev Ctr, Tsurumi Ku, Yokohama, Kanagawa 2300045, Japan
关键词
porosity; pore size distribution; density; fabrication process; chemical vapor infiltration; precursor impregnation and pyrolysis; hot pressing; reaction sintering; satin weave laminate; plain weave laminate; bending strength; Young's modulus; thermal conductivity; thermal shock resistance;
D O I
10.2109/jcersj.109.1271_619
中图分类号
TQ174 [陶瓷工业]; TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
SiC/SiC composites have been considered one of the most attractive materials for high temperature structural applications. The fabrication processes for SiC/SiC composites are typically divided into four types; chemical vapor infiltration (CVI), precursor impregnation and pyrolysis (PIP), hot pressing (HP) and reaction sintering (RS) method. In this work, the microstructures of SiC/SiC composites were evaluated using mercury intrusion method and scanning electron microscopy (SEM) observation. Effect of fabrication process on the microstructures was investigated, and the relationships between microstructural features and some properties, such as bending strength, Young's modulus, thermal conductivity and thermal shock resistance, were discussed.
引用
收藏
页码:619 / 626
页数:8
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