Optical inspection of smartphone camera modules by near-infrared low-coherence interferometry

被引：2
|
作者：
Lee, Chang-Yun [1 ,2 ]
Hyun, Sang-Won [3 ]
Kim, Young-Jin [4 ]
Kim, Seung-Woo [1 ]
机构：
[1] Korea Adv Inst Sci & Technol, Dept Mech Engn, Science Town 305701, Daejeon, South Korea
[2] Samsung Electromech Co Ltd, Cent R&D Ctr, Suwon 443743, Gyeonggi Do, South Korea
[3] Korea Basic Sci Inst, 169-148 Gwahak Ro, Daejeon 34133, South Korea
[4] Nanyang Technol Univ, Sch Mech & Aerosp Engn, 50 Nanyang Ave, Singapore 639798, Singapore
来源：
OPTICAL ENGINEERING | 2016年 / 55卷 / 09期
基金：
新加坡国家研究基金会;
关键词：
low-coherence interferometry; camera module; nondestructive inspection; ALGORITHM;
D O I：
10.1117/1.OE.55.9.091404
中图分类号：
O43 [光学];
学科分类号：
070207 ; 0803 ;
摘要：
High-resolution cameras used for smartphones are comprised of multiple aspheric lenses, a spectral filter, and a semiconductor image sensor, which are packaged together into a single module with tight geometrical tolerances. We investigated the technical possibility of near-infrared low-coherence interferometry for nondestructive geometrical inspection of the complex camera module to examine the inside packaging state. This tomographic scheme enabled us to measure the relative axial position of each inside component and also the lateral surface profile of the image sensor, allowing for comprehensive three-dimensional quality assurance of the whole camera module during the packaging process. (C) 2016 Society of Photo-Optical Instrumentation Engineers (SPIE).
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页数：6
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