A one-step process to engineer superhydrophobic copper surfaces

被引：116
|
作者：
Huang, Y. [1 ]
Sarkar, D. K. [1 ]
Chen, X. -Grant [1 ]
机构：
[1] Univ Quebec, Ctr Univ Rech Aluminium CURAL, Chicoutimi, PQ G7H 2B1, Canada
来源：
MATERIALS LETTERS | 2010年 / 64卷 / 24期
基金：
加拿大自然科学与工程研究理事会;
关键词：
One-step process; Superhydrophobicity; Copper surface; Water contact angle; Scanning electron microscopy; X-ray diffraction; ADHESION; FILMS;
D O I：
10.1016/j.matlet.2010.09.010
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
Superhydrophobic surfaces are conventionally prepared employing two steps: roughening a surface and lowering their surface energy. In the present work, a direct voltage (DC) is applied between two copper plates immersed in a dilute ethanolic stearic acid solution. The surface of the anodic copper electrode transforms to superhydrophobic due to a reaction between copper and stearic add solution. The fabrication process of superhydrophobic copper surfaces is simplified in just one-step. The surface of the anodic copper is found to be covered with flower-like low surface energy copper stearate films providing the water contact angle of 153 +/- 2 degrees with the roll-off properties. (C) 2010 Elsevier B.V. All rights reserved.
引用
收藏
页码：2722 / 2724
页数：3
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