Digital Holographic Study of pH Effects on Anodic Dissolution of Copper in Aqueous Chloride Electrolytes

被引：1

作者：

Yan, Changqi ^{[1
]}

Yuan, Boyu ^{[2
]}

Li, Zhenhui ^{[2
]}

Li, Liang ^{[1
]}

Wang, Chao ^{[1
]}

机构：

[1] Jiangsu Normal Univ, Sch Chem & Mat Sci, Jiangsu Key Lab Green Synthet Chem Funct Mat, Xuzhou 221116, Jiangsu, Peoples R China

[2] Jiangsu Normal Univ, Sch Phys & Elect Engn, Jiangsu Key Lab Adv Laser Mat & Devices, Xuzhou 221116, Jiangsu, Peoples R China

来源：

METALS | 2020年 / 10卷 / 04期

基金：

中国国家自然科学基金;

关键词：

copper; pH effect; anodic polarization; pitting corrosion; holography; ELECTROCHEMICAL-BEHAVIOR; NACL SOLUTION; CORROSION-INHIBITOR; CONCENTRATION FIELD; PITTING CORROSION; MEDIA INFLUENCE; MASS-TRANSFER; BENZOTRIAZOLE; DIFFUSION; ALLOYS;

D O I：

10.3390/met10040487

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The anodic dissolution of copper in chloride electrolytes with different pH has been investigated by using polarization measurements and digital holography. In acidic and neutral NaCl solutions, the oxidation processes of copper are almost the same: copper firstly dissolves as cuprous ions, which then produces the CuCl salt layer. The dissolution rate in the acidic solution is a little higher than that in the neutral. However, the mechanism is quite different in the alkaline NaCl solution: copper turns passive easily due to the formation of a relatively stable Cu2O film which results in pitting, and the dissolution rate of copper decreases before pit initiation.

引用

页数：13

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