A novel method for enabling the thermosonic wire bonding of gold wire onto chips with copper interconnects

被引：3
|
作者：
Jeng, YR [1 ]
Wang, CM
Chiu, SM
Cheng, CY
机构：
[1] Natl Chung Cheng Univ, Dept Mech Engn, Chiayi 621, Taiwan
[2] So Taiwan Univ Technol, Dept Mech Engn, Yung Kang 710, Taiwan
来源：
ELECTROCHEMICAL AND SOLID STATE LETTERS | 2004年 / 7卷 / 12期
关键词：
D O I：
10.1149/1.1819853
中图分类号：
O646 [电化学、电解、磁化学];
学科分类号：
081704 ;
摘要：
The wire bonding of chips with copper interconnects is a challenging issue. The present study develops a method in which the substrates are stored in a temperature and humidity controlled environment such that copper oxide films of appropriate thickness are formed on the substrate prior to the gold-copper thermosonic bonding process. It is shown that this film can be removed during the bonding process, hence rendering the wire bonding process feasible without the requirement for an inert gas environment or the use of metallic cap layers. (C) 2004 The Electrochemical Society.
引用
收藏
页码：G335 / G337
页数：3
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