Trends in microelectronics packaging and interconnection

被引：1

作者：

Chung, T

Haskell, B

机构：

来源：

ICSE '96 - 1996 IEEE INTERNATIONAL CONFERENCE ON SEMICONDUCTOR ELECTRONICS, PROCEEDINGS | 1996年

关键词：

D O I：

10.1109/SMELEC.1996.616438

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Functions and definitions of electronics packaging-along with product-oriented electronics packaging and interconnection technologies, including roadmap and packaging requirements for portable electronics in the year 2000, are reviewed. It has been determined that high-density packaging is the major product driving force in today's highly competitive electronics industry. Accordingly, major trends and developments in microelectronics packaging and interconnection are presented and discussed.

引用

页码：A1 / A5

页数：5

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