Thermomigration of Ti in flip-chip solder joints

被引：12
|
作者：
Chen, Hsiao-Yun [1 ]
Lin, Han-Wen [1 ]
Liu, Chien-Min [1 ]
Chang, Yuan-Wei [1 ]
Huang, Annie T. [2 ]
Chen, Chih [1 ]
机构：
[1] Natl Chiao Tung Univ, Dept Mat Sci & Engn, Hsinchu 30010, Taiwan
[2] Acad Sinica, Res Ctr Appl Sci, Taipei 11529, Taiwan
来源：
SCRIPTA MATERIALIA | 2012年 / 66卷 / 09期
关键词：
Diffusion; Intermetallic compounds; Soldering; Titanium; ELECTROMIGRATION; FAILURE; SN;
D O I：
10.1016/j.scriptamat.2012.01.020
中图分类号：
TB3 [工程材料学];
学科分类号：
0805 ; 080502 ;
摘要：
Titanium has a very large heat of transport value of -768 kJ mol(-1). However, thermomigration of Ti in solder joints has not been examined. In this study, void formation was observed in non-current-stressed Al traces during electromigration and thermomigration tests of SnAg solder joints. Voids formed inside the traces located above the solder bumps with no current flow. We found that Ti thermomigration occurred in the joint, resulting in the reaction of Al and Cu, leaving voids behind in the Al trace. (C) 2012 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
引用
收藏
页码：694 / 697
页数：4
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