Laminar CuO-water nano-fluid flow and heat transfer in a backward-facing step with and without obstacle

被引:26
|
作者
Togun, Hussein [1 ]
机构
[1] Univ Thi Qar, Dept Mech Engn, Nassiriya 64001, Iraq
关键词
Laminar flow; Thermal performance; Separation flow; Backward-facing step; Nano-fluids; THERMAL-CONDUCTIVITY; NUMERICAL-SIMULATION; TRANSFER ENHANCEMENT; NANOFLUIDS; CHANNEL;
D O I
10.1007/s13204-015-0441-7
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
This paper presents a numerical investigate on CuO-water nano-fluid and heat transfer in a backward-facing step with and without obstacle. The range of Reynolds number varied from 75 to 225 with volume fraction on CuO nanoparticles varied from 1 to 4 % at constant heat flux was investigated. Continuity, momentum, and energy equations with finite volume method in two dimensions were employed. Four different configurations of backward-facing step (without obstacle, with obstacle of 1.5 mm, with obstacle of 3 mm, with obstacle of 4.5 mm) were considered to find the best thermal performance. The results show that the maximum augmentation in heat transfer was about 22 % for backward-facing step with obstacle of 4.5 mm and using CuO nanoparticles at Reynolds number of 225 compared with backward-facing step without obstacle. It is also observed that increase in size of recirculation region with increase of height obstacle on the channel wall has remarkable effect on thermal performance. The results also found that increases in Reynolds number, height obstacle, and volume fractions of CuO nanoparticles lead to increase of pressure drop.
引用
收藏
页码:371 / 378
页数:8
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