Simplifying process integration using abrasive-free polishing

被引:0
|
作者
Grief, M [1 ]
Hollands, B [1 ]
机构
[1] Novellus Inc, Chandler, AZ USA
关键词
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
To overcome complications of using traditional CMP high polishing pressure and abrasive content to minimize topography variations, a two-step, low-pressure polishing scheme is proposed. An abrasive-free slurry selectively removes copper with-minimal dishing and is followed by a nonselective polish to maintain low topography.
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页码:69 / +
页数:3
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