Simplifying process integration using abrasive-free polishing

被引：0

作者：

Grief, M ^{[1
]}

Hollands, B ^{[1
]}

机构：

[1] Novellus Inc, Chandler, AZ USA

来源：

SOLID STATE TECHNOLOGY | 2003年 / 46卷 / 11期

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

To overcome complications of using traditional CMP high polishing pressure and abrasive content to minimize topography variations, a two-step, low-pressure polishing scheme is proposed. An abrasive-free slurry selectively removes copper with-minimal dishing and is followed by a nonselective polish to maintain low topography.

引用

页码：69 / +

页数：3

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