A new-type composite material with well sintering properties at low temperature, low dielectric properties, and low thermal expansion coefficient matching well with silcon chips, was developed by designing and optimizing the component & low dielectric constant of CaO-Li2O-B2O3-SiO2-Al2O3 glass and the mass ratio of glass/anorthite composites. The as-prepared CaO-Li2O-B2O3-SiO(2)A1(2)O(3) glass/anorthite composites were sintered at 970 degrees C for 0.5 h, the properties of the composites are as follows: the dielectric constant, 10(-6) dielectric loss, bending strength, and thermal expansion Were 5.125, 2.48 x 10(-3), 105.8 MPa, and 3.38x 10(-6) degrees C-1 (25 similar to 500 degrees C) respectively. Furthermore, the effects of mass ratio of glass/anorthite and microstructure on material properties were also investigated.