Interconnect layout optimization under higher-order RLC model

被引:0
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作者
Cong, J
Koh, CK
机构
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中图分类号
TP3 [计算技术、计算机技术];
学科分类号
0812 ;
摘要
In this paper, we study the interconnect layout optimization problem under a higher-order RLC model to optimize not just delay, but also waveform for RLC circuits with non-monotone signal response. We propose a unified approach that considers topology optimization, wire-sizing optimization, and waveform optimization simultaneously. Our algorithm considers a large class of routing topologies, ranging from shortest-path Steiner trees to bounded-radius Steiner trees and Steiner routings. We construct a set of required-arrival-time Steiner trees or RATS-trees, providing a smooth trade-off among signal delay, waveform, and routing area. Using a new incremental moment computation algorithm, we interleave topology construction with moment computation to facilitate accurate delay calculation and evaluation of waveform quality. Experimental results show that our algorithm is able to construct a set of topologies providing a smooth trade-off among signal delay, signal settling time, voltage overshoot, and routing cost.
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页码:713 / 720
页数:8
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