The Past, Present and Future of Technical Debt Learning from the Past to Prepare for the Future

被引：0
|
作者：
Woods, Eoin [1 ]
机构：
[1] Endava, 125 Old Broad St, London EC2N 1AR, England
来源：
2018 IEEE/ACM INTERNATIONAL CONFERENCE ON TECHNICAL DEBT (TECHDEBT) | 2018年
关键词：
D O I：
10.1145/3194164.3194181
中图分类号：
TP31 [计算机软件];
学科分类号：
081202 ; 0835 ;
摘要：
引用
收藏
页码：61 / 61
页数：1
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