Accelerated ageing and solderability test of tin plated components

被引：0
|
作者：
Dittes, Marc [1 ]
Haubner, Gerhard [1 ]
机构：
[1] Infineon Technol AG, Regensburg, Germany
来源：
2007 9TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, VOLS 1 AND 2 | 2007年
关键词：
D O I：
10.1109/EPTC.2007.4469716
中图分类号：
TP3 [计算技术、计算机技术];
学科分类号：
0812 ;
摘要：
With the introduction of lead (Pb)-free surface finishes on semiconductor components the solderability test conditions used for SnPb surface finishes need a review for their applicability. Due to the lack of data about the correlation of natural ageing and accelerated ageing on the one hand and the correlation of a solderability test like "dip & look" to real board assembly conditions on the other hand it is hardly possible to decide on a solderability test set-up reproducing the reality. In this paper we introduce a suitable mathematical model for the oxidation kinetics of tin surfaces and establish a correlation of natural ageing to accelerated ageing. In a second part results of solderability test are correlated to results from real board assembly.
引用
收藏
页码：79 / 85
页数：7
相关论文
共 50 条
  • [1] ACCELERATED AGEING AND SOLDERABILITY TESTING OF PRINTED WIRING BOARDS.
    Wooldridge, J.R.
    Mather, J.C.
    Circuit World, 1987, 13 (04) : 4 - 6
  • [2] Accelerated testing of tin-plated copper alloy contacts
    Malucci, RD
    IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 1999, 22 (01): : 53 - 60
  • [3] Accelerated testing of tin-plated copper alloy contacts
    IEEE
    不详
    IEEE Trans. Compon. Packag. Technol., 1 (53-60):
  • [4] MEASUREMENT OF SOLDERABILITY OF COMPONENTS
    TENDUIS, JA
    VANDERME.E
    PHILIPS TECHNICAL REVIEW, 1967, 28 (12): : 362 - &
  • [5] Studies on solderability of tin and tin alloy coatings
    Zhuang, Ruifang
    Diandu Yu Jingshi/Plating & Finishing, 19 (04): : 4 - 12
  • [6] Tin whisker accelerated test project
    Lee, Chieh-Ju
    Reynolds, Heidi
    2006 INTERNATIONAL CONFERENCE ON ELECTRONIC MATERIALS AND PACKAGING, VOLS 1-3, 2006, : 697 - +
  • [7] An accelerated aging study of OSPs and their solderability assays via three test methods
    Lee, YR
    Santos, D
    Andros, F
    DiPietro, M
    Forney, L
    Thierolf, C
    PAN PACIFIC MICROELECTRONICS SYMPOSIUM, 2001, PROCEEDINGS, 2001, : 467 - 474
  • [8] SOLDERING, SOLDERABILITY AND SOLDERABILITY TEST IN PRINTED CIRCUITS
    GRASMANN, KH
    METALL, 1972, 26 (01): : 43 - &
  • [9] Thermal accelerated ageing test method development
    Bégin, PL
    Kaminska, E
    RESTAURATOR-INTERNATIONAL JOURNAL FOR THE PRESERVATION OF LIBRARY AND ARCHIVAL MATERIAL, 2002, 23 (02) : 89 - 105
  • [10] Effects on LEDs during the Accelerated Ageing Test
    Becirovic, V
    Helac, V
    Arslanagic, B.
    Samic, H.
    2019 18TH INTERNATIONAL SYMPOSIUM INFOTEH-JAHORINA (INFOTEH), 2019,
12345