Fabrication of a high heat dissipating double-sided printed circuit board

被引：0
|
作者：
Hu, WC [1 ]
Yang, CR [1 ]
Qiu, Y [1 ]
Zhu, L [1 ]
机构：
[1] Univ Elect Sci & Technol China, Coll Microelect & Solid Elect, Chengdu 610054, Sichuan, Peoples R China
来源：
PLATING AND SURFACE FINISHING | 2005年 / 92卷 / 10期
关键词：
D O I：
暂无
中图分类号：
TF [冶金工业];
学科分类号：
0806 ;
摘要：
The technique for fabricating high heat dissipating double-sided printed circuit boards (PCB) was studied and we have developed an improved process to prepare them. Films of aluminum oxide are grown on circuit elements by anodization. Polyimide mixed with fine aluminum nitride powder is used as a binder to improve the thermal conductivity. The aluminum-base PCB is prepared after lamination, etching and subsequent steps. Thermal resistance testing of the PCB showed a value of less than 0.125 K degrees/W(.)m(2).
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页码：42 / 45
页数：4
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