Concept of a Mechanical Test Setup for Packaging Materials Using Digital Image Correlation Methods

被引:1
|
作者
Wiss, E. [1 ]
Barth, D. [1 ]
Wiese, S. [1 ]
机构
[1] Saarland Univ, Chair Microintegrat & Reliabil, Saarbrucken, Germany
关键词
SOLDER MATERIALS; LEAD-FREE; STRESS; COPPER;
D O I
10.1109/EuroSimE52062.2021.9410859
中图分类号
O414.1 [热力学];
学科分类号
摘要
This paper presents a concept for a mechanical testing apparatus for electronic packaging materials that benefits from the usage of digital image correlation (DIC) for strain measurement. In contrast to similar test setups, which use a CCD-microscope as an attachment to the mechanical test setup, the new concept tries to attach the mechanical test setup to a professional research microscope. The intention is to improve the projection of the object field to the CCD sensor array of the microscope-camera, and thus to improve the strain measurement of miniaturized samples. To be able to perform experiments at higher temperatures a suitable temperature-controlled test chamber was also designed. The paper shows the realization of the test setup and presents the first experiments with suitable specimen that will also be discussed.
引用
收藏
页数:6
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