Hull cell studies on copper electrodeposition from sulphamate bath

wElectrodeposited copper serves as a preplate before deposition of nickel, silver or gold. It is also used to prevent case hardening on selected areas of ferrous metal surface. Because of its Enhanced electrical conductivity, it is used in electronics and in printed circuit board production, The grain structure of copper deposits from acid sulphate bath is less fine compared to the structure from cyanide baths. To cope up with the stringent pollution control regulations, there is a need to replace cyanide bath by non-toxic ones, There are a lot of plating compositions for copper deposition, based upon cyanide, sulphate, chloride etc. with proven usefulness in the industries. However, above types of baths are either toxic or highly acidic requiring pollution control treatments. Hence it was decided to investigate a bath which will be nontoxic. From view point, sulphamic acid was considered as one of the best alternatives as it is weakly acidic and nonpoisonous.