Packaging technology in MEMS

被引：0
|
作者：
Shi, YB [1 ]
Liu, J [1 ]
Zhang, WD [1 ]
机构：
[1] N China Inst Technol, Dept Elect Engn, Minist Educ China, Key Lab Instrumentat Sci & Dynam Measurement, Shanxi Taiyuan 030051, Peoples R China
来源：
ISTM/2003: 5TH INTERNATIONAL SYMPOSIUM ON TEST AND MEASUREMENT, VOLS 1-6, CONFERENCE PROCEEDINGS | 2003年
关键词：
packaging; MEMS; flip chip;
D O I：
暂无
中图分类号：
TH7 [仪器、仪表];
学科分类号：
0804 ; 080401 ; 081102 ;
摘要：
MEMS is a relatively new field which is tied so closely with silicon processing that most of the early packaging technologies will most likely use "off-the-shelf" packaging "borrowed" from the semiconductor microelectronics field. In this paper, the present packaging types are first introduced, and then elaborated the Chip Scale Package which is the cost-effective replacement fore the traditional hermetic package, finally, some commercial packages for MEMS devices is given.
引用
收藏
页码：175 / 178
页数：4
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