Low-cost packaging of inertial MEMS devices

被引：0

作者：

Felton, LE ^{[1
]}

Duffy, M ^{[1
]}

Hablutzel, N ^{[1
]}

Farrell, PW ^{[1
]}

Webster, WA ^{[1
]}

机构：

[1] Analog Devices Inc, Micromachined Prod Div, Cambridge, MA USA

来源：

2003 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS | 2003年 / 5288卷

关键词：

MEMS packaging; wafer-scale packaging; accelerometer; wafer capping;

D O I：

暂无

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Wafer scale capping processes have been developed to protect MEMS accelerometers from damage during standard transfer molding assembly processes. This paper details a wafer scale capping process developed for integrated MEMS accelerometers. The process consists of several steps including fabricating the cap wafer, application of seal glass by screen printing; aligned wafer bonding and separation of the cap wafer into individual caps. At the end of the process, the capped die are assembled in an industry standard eight lead SOIC package with and exposed die paddle.

引用

页码：402 / 406

页数：5

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