Beyond 3G: Metamaterials application to the air interface

被引：0

作者：

Stoytchev, Marin ^{[1
]}

Gummalla, Ajay ^{[1
]}

Achour, Maha ^{[1
]}

Poilasne, Gregory ^{[1
]}

机构：

[1] Rayspan Corp, San Diego, CA 92130 USA

来源：

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

页码：1053 / 1056

页数：4

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