Innovative fault isolation analysis technique to identify Failure Mechanism on Recovering Device Failure

被引：0
|
作者：
Ahmad, Izhar Helmi [1 ]
Van Alferez, Anton [1 ]
Yusof, Yusnani Muhamad [1 ]
机构：
[1] ON Semicond Malaysia Sbn Bhd, Prod Anal Lab, Lot 122,Senawang Ind Estate, Seremban 70450, Negeri Sembilan, Malaysia
来源：
Proceedings of the 2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) | 2016年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Failure analysis (FA) plays an important role in the semiconductor industry as the process technology and new packaging is continuously improved. Missed out failure mechanisms and device recovery is a growing challenge in the FA field. In this paper, a new FA method is presented. A precise backside Fault Isolation was utilized in combination with Cross-section and Focused Ion Beam to uncover the Failure mechanism. The application of this method will be discussed on two case studies with different failure mechanisms.
引用
收藏
页码：374 / 378
页数：5
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