Simulation model development for solder joint reliability for high performance FBGA assemblies

被引：3
|
作者：
Qi, HY [1 ]
Lee, M [1 ]
Osterman, M [1 ]
Lee, K [1 ]
Oh, SY [1 ]
Schmidt, T [1 ]
机构：
[1] Univ Maryland, CALCE Elect Prod & Syst Ctr, College Pk, MD 20770 USA
来源：
TWENTIETH ANNUAL IEEE SEMICONDUCTOR THERMAL MEASUREMENT AND MANAGEMENT SYMPOSIUM, PROCEEDINGS 2004 | 2004年
关键词：
FBGA; FEA; warpage; fatigue life;
D O I：
10.1109/STHERM.2004.1291338
中图分类号：
O414.1 [热力学];
学科分类号：
摘要：
New construction of fine pitch plastic ball grid array (FBGA) has been investigated through experimentation and physics of failure (PoF) analysis based on the reliability point of view. In this study, a three dimensional FEA model was developed to understand the thermomechanical behavior of FBGA under cyclic thermal loading environments. Experimental measurement was also carried out and the package warpage information was recorded by high-resolution digital CCD cameras with a 3-D image correlation method to validate this FEA model. The validated FEA model was used to calculate the inelastic strain of FBGA package that is related to the fatigue life of solder joint.
引用
收藏
页码：300 / 307
页数：8
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