Adsorption competition of Cu(II) ion in ionic pair and multi-metal solution by ionic imprinted amino-silica hybrid adsorbent

It was carried out the synthesis of the Cu(II) ionic imprinted polymer (Cu(II)-IIP) material of amino-silica hybrid via sol-gel process using a tetraethyl-orthosilicate precursor and an active compound 3-aminopropyltrimetoxyslane. Adsorption process of Cu(II) ion on non-imprinted ionic (NIP) material and Cu(II)-IIP follows pseudo-first-order kinetics model with the value of adsorption rate constants (k(1)) 0.030 and 0.058L/min and Langmuir adsorption isotherm with the value of adsorption capacity 29.556 and 71.400mg/g, respectively. Adsorption competition data in ion pair solution of Cu(II)/Ag(I), Cu(II)/Zn(II), Cu(II)/Ni(II), and Cu(II)/Cd(II) showed that the Cu(II)-IIP adsorbent was more selective than NIP with value of selectivity coefficient ()>1. A tendency of metal ion adsorbed in multi-metal solution follows this order: Ca(II)<Cd(II)<Ni(II)<Zn(II)<Ag(I)<Cu(II). The Cu(II)-IIP is stable chemically and it can be reused for adsorption of Cu(II) ion in solution without reduction of its capacity.