A MEMS-based shear stress sensor for high temperature applications

被引:0
|
作者
Tiliakos, Nicholas [1 ]
Papadopoulos, George [1 ]
O'Grady, Andrew M.
Modi, Vijay
Larger, Ronan
Frechette, Luc G.
机构
[1] ATK GASL, Adv Concepts Grp, Ronkonkoma, NY USA
来源
FEDSM 2007: PROCEEDINGS OF THE 5TH JOINT ASME/JSME FLUIDS ENGINEERING SUMMER CONFERENCE, VOL 2, PTS A AND B | 2007年
关键词
MEMS sensor; shear stress; supersonic flow; hypersonic flow; high temperature; propulsion; flow control; boundary layer separation;
D O I
暂无
中图分类号
TH [机械、仪表工业];
学科分类号
0802 ;
摘要
Micro-electro-mechanical systems (MEMS) are an enabling technology that has lead to various miniature sensor concepts. Utilizing recent advances in silicon carbide (SiC) MEMS fabrication techniques allows for the development of a new series of sensors that leverages the high temperature capabilities of SiC. One such sensor concept is a shear stress sensor that can operate over a high dynamic range, and at very high temperatures, with an application emphasis on ground and flight testing in supersonic and hypersonic flow. The application of this fundamental sensor element and capacitance sensing design to very high temperature and very high shear environment, however, brings another set of challenges that involve the associated packaging and electrical control scheme. While this project is still a work in progress, we present an overview of our efforts to design, develop, fabricate and test a MEMS shear stress sensor for hypersonic aeropropulsion test and evaluation applications.
引用
收藏
页码:1477 / 1478
页数:2
相关论文
共 50 条
  • [1] On the modeling of a MEMS-based capacitive wall shear stress sensor
    Rezazadeh, Ghader
    Lotfiani, Amin
    Khalilarya, Shahram
    MEASUREMENT, 2009, 42 (02) : 202 - 207
  • [2] Polymer MEMS-based Fabry-Perot shear stress sensor
    Tseng, FG
    Lin, CJ
    IEEE SENSORS JOURNAL, 2003, 3 (06) : 812 - 817
  • [3] Effect of conjugate heat transfer on MEMS-based thermal shear stress sensor
    Chao, Jianghui
    Shyy, Wei
    Thakur, Siddharth S.
    Sheplak, Mark
    Mei, Renwei
    HT2005: PROCEEDINGS OF THE ASME SUMMER HEAT TRANSFER CONFERENCE 2005, VOL 4, 2005, : 773 - 788
  • [4] MEMS-Based Shear-Stress Sensor for Skin-Friction Measurements
    Xiang, Dan
    Yang, Yubing
    Xu, Yong
    Li, Yuefa
    2010 IEEE INTERNATIONAL INSTRUMENTATION AND MEASUREMENT TECHNOLOGY CONFERENCE I2MTC 2010, PROCEEDINGS, 2010,
  • [5] Effect of conjugate heat transfer on MEMS-based thermal shear stress sensor
    Chao, Jianghui
    Shyy, Wei
    Thakur, Siddharth S.
    Sheplak, Mark
    Mei, Renwei
    ADVANCES IN ELECTRONIC PACKAGING 2005, PTS A-C, 2005, : 2213 - 2228
  • [6] Effect of conjugate heat transfer on MEMS-based thermal shear stress sensor
    Chao, JH
    Shyy, W
    Thakur, SS
    Sheplak, M
    Mei, RW
    NUMERICAL HEAT TRANSFER PART A-APPLICATIONS, 2005, 48 (03) : 197 - 217
  • [7] MEMS-based sensor arrays for military applications
    Ruffin, PB
    SMART STRUCTURES AND MATERIALS 2002: SMART ELECTRONICS, MEMS, AND NANOTECHNOLOGY, 2002, 4700 : 111 - 121
  • [8] MEMS-based force sensor:: Design and applications
    López, D
    Decca, RS
    Fischbach, E
    Krause, DE
    BELL LABS TECHNICAL JOURNAL, 2005, 10 (03) : 61 - 80
  • [9] A MEMS-Based, high-sensitivity pressure sensor for ultraclean semiconductor applications
    Henning, AK
    Mourlas, N
    Metz, S
    Zias, A
    2002 IEEE/SEMI ADVANCED SEMICONDUCTOR MANUFACTURING CONFERENCE AND WORKSHOP: ADVANCING THE SCIENCE OF SEMICONDUCTOR MANUFACTURING EXCELLENCE, 2002, : 165 - 168
  • [10] A CMOS Temperature Sensor for MEMS-based Frequency Source
    Jin, Jing
    Chen, Xing
    Huang, Jiwei
    2021 PHOTONICS & ELECTROMAGNETICS RESEARCH SYMPOSIUM (PIERS 2021), 2021, : 1279 - 1284