Simulation and Thermal Fatigue Analysis for Board Level BGA Connection of HTCC Packaging

被引：0
|
作者：
Li, Yangyang [1 ]
Wang, Hui [1 ]
Li, Yang [1 ]
Dong, Dong [1 ]
Zhang, Yanming [1 ]
Lu, Yinquan [1 ]
机构：
[1] Southwest China Res Inst Elect Equipment, Chengdu, Peoples R China
来源：
2020 21ST INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) | 2020年
关键词：
HTCC; thermal shock; finite element; fatigue;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
In this paper, four kinds of 3D finite element analysis (FEA) model for a particular size of HTCC packaging (23mmx15mm) were simplified and described in depth study of thermodynamic behavior for solder ball joint under alternating temperature load. There were four kinds of solder balls taken into our consideration, namely, 0.45mm diameters Sn63Pb37 tin lead solder ball, 0.6mm diameters Sn63Pb37 tin lead solder ball, 0.45mm diameters Sn10Pb90 high lead solder ball and 0.6mm diameters Sn10Pb90 high lead solder ball. From our study, the use of Sn10Pb90 high lead solder ball can obviously reduce the max principle stress of HTCC substrate under BGA solder adjacent areas, meanwhile, improving the thermal fatigue life of solder ball. In our research, in order to meet the requirements of air sealing, metal frame structures were soldered to the HTCC substrate, from which the extra added weights also cause adverse effects upon solder ball joints, leading to high internal thermal strain/stress and low thermal fatigue life.
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页数：5
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