Assembly of Micro-3-D Components on SOI Wafers Using Novel SU-8 Locking Mechanisms and Vertical One-Push Operation

被引：4

作者：

Chiu, Yi ^{[1
]}

Wu, Chang-Shiou ^{[1
]}

Huang, Wei-Zhi ^{[1
]}

Wu, Jhong-Wei ^{[1
]}

机构：

[1] Natl Chiao Tung Univ, Dept Elect & Control Engn, Hsinchu 300, Taiwan

来源：

IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS | 2009年 / 15卷 / 05期

关键词：

Assembly; hinge; microelectromechanical system (MEMS); one push; out of plane; DESIGN; FABRICATION;

D O I：

10.1109/JSTQE.2009.2018478

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A novel out-of-plane assembly technique of 3-D microstructures is proposed and demonstrated by using simple vertical one-push operations. This one-push method has large probe positioning tolerance in both vertical and lateral directions to reduce the overall complexity of the assembly process. Micromirrors and corner cube reflectors are fabricated on silicon-on-insulator wafers using SU-8 photoresist as a second structure layer in a low-temperature process. Batch assembly of multiple mirrors assembled simultaneously is demonstrated.

引用

页码：1338 / 1343

页数：6