Lead-free solder implementation: Reliability, alloy development, new technology - Foreword

被引：0
|
作者：
Chawla, Nik [1 ]
Chada, Srinivas
Kang, Sung K.
Kao, C. Robert
Lin, Kwang-Lung
Lucas, Jim
Turbini, Laura
机构：
[1] Arizona State Univ, Tempe, AZ 85287 USA
[2] Natl Cheng Kung Univ, Tainan 70101, Taiwan
[3] Michigan State Univ, E Lansing, MI 48824 USA
[4] Univ Toronto, Toronto, ON, Canada
来源：
JOURNAL OF ELECTRONIC MATERIALS | 2006年 / 35卷 / 12期
关键词：
D O I：
10.1007/s11664-006-0315-6
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：2073 / 2073
页数：1
相关论文
共 50 条
  • [1] Lead-free implementation: Reliability, alloy development, and new technology
    Srinivas Chada
    JOM, 2006, 58 : 56 - 56
  • [2] Lead-free implementation: Reliability, alloy development, and new technology
    Chada, S
    JOM, 2006, 58 (06) : 56 - 56
  • [3] New lead-free solder alloy
    Kamal, M
    Meikhail, MS
    El-Bediwi, AB
    Gouda, ES
    RADIATION EFFECTS AND DEFECTS IN SOLIDS, 2005, 160 (07): : 301 - 312
  • [4] Analysis of new lead-free solder alloy microstructure
    Geng Zhiting
    Heqing
    Cheng Guohai
    Ma Jusheng
    2012 13TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2012), 2012, : 468 - 470
  • [5] Reliability of lead-free solder alloys
    Igoshev, V
    Kleiman, J
    ENVIRONMENT CONSCIOUS MATERIALS - ECOMATERIALS, 2000, : 703 - 715
  • [6] Reliability of solder paste and solder pre-coating technology by lead-free Sn-Zn base solder alloy
    Sakai, T
    Amita, H
    Shibuya, Y
    Kurozumi, T
    Nagasaki, S
    Shoji, T
    2000 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS, 2000, 4339 : 293 - 302
  • [7] Lead-free and lead-bearing electronic solders: Implementation, reliability, and new technology
    Kao, C. Robert
    JOM, 2008, 60 (06) : 60 - 60
  • [8] Lead-free and lead-bearing electronic solders: Implementation, reliability, and new technology
    C. Robert Kao
    JOM, 2008, 60 : 60 - 60
  • [9] Reliability of solder joints assembled with lead-free solder
    Ochiai, Masayuki
    Akamatsu, Toshiya
    Ueda, Hidefumi
    2002, Fujitsu Ltd (38):
  • [10] Reliability of solder joints assembled with lead-free solder
    Ochiai, M
    Akamatsu, T
    Ueda, H
    FUJITSU SCIENTIFIC & TECHNICAL JOURNAL, 2002, 38 (01): : 96 - 101
12345