Analysis with 3D FEA of Partial Demagnetization for an IPM PMSG

被引:0
|
作者
Quintal Palomo, Roberto Eduardo [1 ]
Banuelos, Manuel Flota [1 ]
Escalante, Ricardo Peon [1 ]
Bondarenko, Oleksandr [2 ]
机构
[1] Univ Autonoma Yucatan, Fac Ingn, Merida, Yucatan, Mexico
[2] Igor Sikorsky Kyiv Polytech Inst, Dept Elect Devices & Syst, Kiev, Ukraine
来源
2020 IEEE KHPI WEEK ON ADVANCED TECHNOLOGY (KHPI WEEK) | 2020年
关键词
FEA; IPM; PMSG; Asymmetric; 3D; MAGNET; ROTOR; FAULT;
D O I
暂无
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The analysis of the variation on the machine's back EMF, is done and compared between different levels of partial demagnetization. The interior permanent magnet machine (IPM), has 4 poles designed to be asymmetric with the consequent pole approach. The results from the Finite Element Analysis (FEA) in 2D and 3D are compared to laboratory measurements with same conditions. Good agreement was found for the 3D FEA result's back EMF, making this approach suitable for fault detection and diagnosis studies.
引用
收藏
页码:309 / 313
页数:5
相关论文
共 50 条
  • [1] Biomechanical Behaviour of Tooth-supported Fixed Partial Dentures by 3d Fea
    Naveau, Adrien
    Chesneau, Jonathan
    Barquins, Michel
    Pierrisnard, Laurent
    EUROPEAN JOURNAL OF PROSTHODONTICS AND RESTORATIVE DENTISTRY, 2009, 17 (04): : 157 - 163
  • [2] A method for 3D mesh adaptation in FEA
    Sfarni, S.
    Bellenger, E.
    Fortin, J.
    Guessasma, M.
    PROCEEDINGS OF WORLD ACADEMY OF SCIENCE, ENGINEERING AND TECHNOLOGY, VOL 22, 2007, 22 : 571 - +
  • [3] 3D FEA modeling of hard turning
    Guo, YB
    Liu, CR
    JOURNAL OF MANUFACTURING SCIENCE AND ENGINEERING-TRANSACTIONS OF THE ASME, 2002, 124 (02): : 189 - 199
  • [4] Board Level WLCSP 3D Thermal Stress Analysis by Submodeling of FEA
    Hong, RongHua
    Wang, Jun
    2010 11TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP), 2010, : 762 - 766
  • [5] 3D Active Demagnetization of Cold Magnetic Shields
    Polyakov, Yuri A.
    Semenov, Vasili K.
    Tolpygo, Sergey K.
    IEEE TRANSACTIONS ON APPLIED SUPERCONDUCTIVITY, 2011, 21 (03) : 724 - 727
  • [6] The 3D Eyeball FEA Model with Needle Rotation
    Wu, Jing
    Nasseri, M. A.
    Eder, M.
    Gavaldon, M. Azqueta
    Lohmann, C. P.
    Knoll, Alois
    3RD INTERNATIONAL CONFERENCE ON BIOMEDICAL ENGINEERING AND TECHNOLOGY - ICBET 2013, 2013, 7 : 4 - 10
  • [7] Assembly process induced stress analysis for new FLMP package by 3D FEA
    Liu, Y
    Irving, S
    Tumulak, M
    Cabahug, EA
    52ND ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2002 PROCEEDINGS, 2002, : 604 - 610
  • [8] A New Methodology for the Structural Analysis of 3D Digitized Cultural Heritage through FEA
    Barsanti, Sara Gonizzi
    Guidi, Gabriele
    FLORENCE HERI-TECH - THE FUTURE OF HERITAGE SCIENCE AND TECHNOLOGIES, 2018, 364
  • [9] Comparison of 2D and 3D FEA of a BLDC motor
    Wang, S
    Kang, J
    Park, K
    Yoon, H
    Jang, G
    COMPEL-THE INTERNATIONAL JOURNAL FOR COMPUTATION AND MATHEMATICS IN ELECTRICAL AND ELECTRONIC ENGINEERING, 2000, 19 (02) : 529 - 537
  • [10] A 3D nonlinear FEA model for simulation of microbubble behavior
    Patil, Abhay V.
    Reynolds, Paul
    Milner, David
    Hossack, John A.
    2008 IEEE ULTRASONICS SYMPOSIUM, VOLS 1-4 AND APPENDIX, 2008, : 985 - +