Phase-field modeling of rapid solidification

被引：21
|
作者：
Kim, SG [1 ]
Kim, WT
机构：
[1] Kunsan Natl Univ, RASOM, Kunsan 573701, South Korea
[2] Kunsan Natl Univ, Dept Mat Sci & Engn, Kunsan 573701, South Korea
[3] Chongju Univ, Dept Phys, RASOM, Chongju 360764, South Korea
[4] Chongju Univ, Dept Phys, Ctr Noncrystalline Mat, Chongju 360764, South Korea
来源：
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING | 2001年 / 304卷 / 1-2期
关键词：
phase-field model; rapid solidification; banded structure;
D O I：
10.1016/S0921-5093(00)01453-2
中图分类号：
TB3 [工程材料学];
学科分类号：
0805 ; 080502 ;
摘要：
Rapid directional solidification under a constant thermal gradient was simulated by a new phase-field model. The banded structures in an Al-Cu alloy were successfully reproduced. Only a few cells or dendrites survive in every transition steps into the plane-front mode, which explains the large grain size of banded structure observed in experiments. The noise level in concentration plays a crucial role in the transition procedure of the cell/dendrite into the plane-front mode and so in the overall pattern formation of the banded structure. (C) 2001 Elsevier Science B.V. All rights reserved.
引用
收藏
页码：281 / 286
页数：6
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