The effects of Cl- ion concentration and relative humidity on atmospheric corrosion behaviour of PCB-Cu under adsorbed thin electrolyte layer

被引:94
|
作者
Huang, Hualiang [1 ]
Dong, Zehua [1 ]
Chen, Zhenyu [1 ]
Guo, Xingpeng [1 ]
机构
[1] Huazhong Univ Sci & Technol, Sch Chem & Chem Engn, Hubei Key Lab Mat Chem & Serv Failure, Wuhan 430074, Peoples R China
基金
中国国家自然科学基金;
关键词
Copper; EIS; Atmospheric corrosion; ELECTROCHEMICAL IMPEDANCE SPECTROSCOPY; AC-IMPEDANCE; COPPER; METALS; ALLOY; ALUMINUM; URBAN; STEEL; RAIN; SULFIDATION;
D O I
10.1016/j.corsci.2010.12.018
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The effects of Cl- ion concentration and relative humidity on atmospheric corrosion behaviour of PCB-Cu under adsorbed thin electrolyte layer were investigated by cathodic polarization curves and electrochemical impedance spectroscopy. Results indicated that the cathodic process of PCB-Cu corrosion was dominated by the reduction of oxygen and corrosion products. The cathodic current density increased with increasing relative humidity and Cl- ion concentration. The corrosion rate was initially dominated by oxygen reduction, but at the later stage of corrosion, the anodic process began to affect the corrosion rate due to the accumulation of corrosion products. Crown Copyright (C) 2010 Published by Elsevier Ltd. All rights reserved.
引用
收藏
页码:1230 / 1236
页数:7
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