Sweat effects on the thermal analysis of epidermal electronic devices integrated with human skin

被引:23
|
作者
Cui, Yun [1 ]
Li, Yuhang [1 ,2 ,3 ]
Xing, Yufeng [1 ]
机构
[1] Beihang Univ BUAA, Inst Solid Mech, Beijing 100191, Peoples R China
[2] Huazhong Univ Sci & Technol, State Key Lab Digital Mfg Equipment & Technol, Wuhan 430074, Hubei, Peoples R China
[3] Xi An Jiao Tong Univ, Sch Aerosp Engn, State Key Lab Strength & Vibrat Mech Struct, Xian 710049, Shaanxi, Peoples R China
基金
中国国家自然科学基金;
关键词
Thermal management; Epidermal electronic devices; Sweat; HEAT; SENSORS; TISSUE; PRESSURE; DESIGN;
D O I
10.1016/j.ijheatmasstransfer.2018.07.105
中图分类号
O414.1 [热力学];
学科分类号
摘要
Epidermal electronic devices (EEDs) are widely used in many applications especially directly integrated with human skin tissue to monitor the vital signs of human body. The thermal management of EEDs is very critical because the excessive temperature increase may cause discomfort or damage to human skin. Sweating can also significantly change the thermal environment of EED/skin system due to its function on the thermal transport process. A three-dimensional heat transfer analytical model is established to predict the thermal characteristics of EED/skin system considering the bio-heat transfer and effects of sensible sweat. In this model, the heat conductions in EEDs and in human skin are taken into account with Fourier heat transfer equation and Pennes bio-heat transfer equation, respectively, including the transport process of sweating. The results are validated by finite element analysis (FEA) and parameters studies such as velocity of sweat, thermal conductivity and thickness of substrate have been investigated. The results can help guide the thermal management of EED/skin system considering effects of sensible sweat. (C) 2018 Elsevier Ltd. All rights reserved.
引用
收藏
页码:97 / 104
页数:8
相关论文
共 50 条
  • [1] Thermal analysis of epidermal electronic devices integrated with human skin considering the effects of interfacial thermal resistance
    Li, Yuhang
    Zhang, Jianpeng
    Xing, Yufeng
    Song, Jizhou
    AIP ADVANCES, 2018, 8 (05)
  • [2] Thermomechanical Analysis of Epidermal Electronic Devices Integrated With Human Skin
    Li, Yuhang
    Zhang, Jianpeng
    Xing, Yufeng
    Song, Jizhou
    JOURNAL OF APPLIED MECHANICS-TRANSACTIONS OF THE ASME, 2017, 84 (11):
  • [3] Effects of Thermal Resistance on One-Dimensional Thermal Analysis of the Epidermal Flexible Electronic Devices Integrated with Human Skin
    Li, He
    Cui, Yun
    1ST INTERNATIONAL CONFERENCE ON FRONTIERS OF MATERIALS SYNTHESIS AND PROCESSING (FMSP 2017), 2017, 274
  • [4] Transient thermomechanical analysis of epidermal electronic devices on human skin
    Zhang Jianpeng
    Li Yuhang
    Xing Yufeng
    Song Jizhou
    MECHANICS OF MATERIALS, 2019, 137
  • [5] One-Dimensional Thermal Analysis of the Flexible Electronic Devices Integrated with Human Skin
    Cui, Yun
    Li, Yuhang
    Xing, Yufeng
    Yang, Tianzhi
    Song, Jizhou
    MICROMACHINES, 2016, 7 (11)
  • [6] Three-dimensional thermomechanical analysis of epidermal electronic devices on human skin
    Zhang, Jianpeng
    Li, Yuhang
    Xing, Yufeng
    Song, Jizhou
    INTERNATIONAL JOURNAL OF SOLIDS AND STRUCTURES, 2019, 167 : 48 - 57
  • [7] Thermal management of flexible wearable electronic devices integrated with human skin considering clothing effect
    Yin, Yafei
    Cui, Yun
    Li, Yuhang
    Xing, Yufeng
    Li, Min
    APPLIED THERMAL ENGINEERING, 2018, 144 : 504 - 511
  • [8] Thermal management of epidermal electronic devices/skin system considering insensible sweating
    Nie, Shuang
    Zhang, Chenxi
    Song, Jizhou
    SCIENTIFIC REPORTS, 2018, 8
  • [9] Thermal management of epidermal electronic devices/skin system considering insensible sweating
    Shuang Nie
    Chenxi Zhang
    Jizhou Song
    Scientific Reports, 8
  • [10] The Thermal Design of ASM Integrated Electronic Devices
    Li, Jian-Hua
    Wang, Wei-Hua
    Rao, Ting-Ting
    Zhu, Wei-Bo
    MECHANICS AND MATERIALS SCIENCE, 2018, : 364 - 370