Fine Leak Batch Testing of Multiple MEMS Packages

被引：0
|
作者：
Jang, Changsoo [1 ]
Youn, Byeng Dong [1 ]
Ham, Suk-Jin [2 ]
Han, Bongtae [1 ]
机构：
[1] Univ Maryland, College Pk, MD 20742 USA
[2] Samsung Electro Mech, Suwon, South Korea
来源：
RELIABILITY, PACKAGING, TESTING, AND CHARACTERIZATION OF MEMS/MOEMS AND NANODEVICES VIII | 2009年 / 7206卷
关键词：
hermeticity; gas leakage; molecular conduction; helium fine leak test; batch test;
D O I：
10.1117/12.810004
中图分类号：
TB3 [工程材料学];
学科分类号：
0805 ; 080502 ;
摘要：
An analysis method for fine leak batch testing is developed for effective hermeticity inspection of metal-sealed MEMS packages in a mass production environment. It employs a forward-stepwise regression analysis based on a physical gas flow model to infer the information of leaky packages from batch test data. The proposed method can determine accurately the number of leaky packages and the true leak rate of each leaky package when the number of leaky packages in a batch is less than 5. A top-down hierarchical batch test is proposed as a reliable and effective test scheme by addressing this limitation of the developed analysis scheme.
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页数：6
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