The stress intensity factors (SIFs) of cracked half-plane specimen in contact with semi-circular object

被引:5
|
作者
Sanati, H. [1 ]
Amini, A. [1 ]
Reshadi, F. [1 ]
Soltani, N. [1 ]
Faraji, G. [1 ]
Zalnezhad, E. [2 ]
机构
[1] Univ Tehran, Coll Engn, Sch Mech Engn, Tehran 111554563, Iran
[2] Univ Malaya, Fac Engn Bldg, Dept Mech Engn, Kuala Lumpur 50603, Malaysia
关键词
Photoelasticity; Stress intensity factors; Contact; Cracked half-plane; SURFACE CRACKS; FRINGE ORDER; PHOTOELASTICITY; BODIES; INCREMENTATION; PARAMETERS; FRICTION; WEDGE;
D O I
10.1016/j.tafmec.2014.11.002
中图分类号
TH [机械、仪表工业];
学科分类号
0802 ;
摘要
In this paper, photoelasticity technique was used to analyze the stress intensity factors (SIFs) of semi-infinitive plate with an edge crack in contact with the semi-circular wedge. The effects of different parameters such as crack angle, crack length, semi-circular wedge diameter and distance between the crack and the wedge tip on the second mode of stress intensity factor were investigated using experimental tests and numerical simulations. The crack length, crack angle, magnitude of the applied load, the distance between crack tip and loading position were varied ifs the tests. Image processing and linear elastic fracture mechanic (LEFM) method were used to compute SIFs from fringe patterns acquired from the experimental tests. Finally, a large number of finite element analyses have been carried out, and then numerical and experimental results were compared. The amount of the relative differences between numerical and experimental results was less than 9.8% indicating the high accuracy and good agreement. (C) 2014 Elsevier Ltd. All rights reserved.
引用
收藏
页码:104 / 112
页数:9
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