Elastic properties of Sn-based Pb-free solder alloys determined by ultrasonic pulse echo method

被引：22
|
作者：
Tanaka, H [1 ]
Qun, LF
Munekata, O
Taguchi, T
Narita, T
机构：
[1] Hokkaido Ind Res Inst, Sapporo, Hokkaido 0600819, Japan
[2] Hokkaido Univ, Grad Sch Engn, Sapporo, Hokkaido 0608628, Japan
[3] Senju Met Ind Co Ltd, Sohka 3400023, Japan
来源：
MATERIALS TRANSACTIONS | 2005年 / 46卷 / 06期
关键词：
Young's modulus; Poisson's ratio; lead free solder; ultrasonic pulse echo method;
D O I：
10.2320/matertrans.46.1271
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
The Young's modulus (E) and Poisson's ratio m of Sn-based lead-free solders as Sn-3.5Ag, Sn-58Bi and Sn-9Zn (compositions in mass%) were measured at various temperatures between -50 and 100 C using an ultrasonic pulse echo method. The values of Young's modulus and Poisson's ratio were obtained at 25 C. These values coincide with the room temperature values in the literature. The Young's modulus and Poisson's ratio between -50 and 100 C were also measured for Sn-58Bi. Sn-9Zn, and Sn-37Pb.
引用
收藏
页码：1271 / 1273
页数：3
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