Post-annealing effects on trapping behaviors in AdGaN/GaN HEMTs

被引:3
|
作者
Kim, H [1 ]
Lee, J [1 ]
Lu, W [1 ]
机构
[1] Ohio State Univ, Dept Elect & Comp Engn, Columbus, OH 43210 USA
关键词
D O I
10.1002/pssa.200461555
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Trapping effects in AlGaN/GaN high-electron mobility transistors (HEMTs) are investigated using dynamic current-voltage (I-V) measurements with different quiescent biases and pulse widths to examine post-annealing effects after Schottky gate formation. The results show that trapping/detrapping phenomena by traps with emission/capture time constants of shorter than 10 mu s are dominant in non-annealed devices. The devices annealed at 400 degrees C for 10 minutes in a furnace exhibit significantly smaller current dispersion and have a smaller number of traps. However, after post-annealing, a small number of traps with a time constant of longer than 10 mu s are created or activated. Further annealing at 400 degrees C leads to increase in current dispersion, indicating that more traps with an emission time constant > 10 mu s are created. These traps induced by post-annealing are responsible for the trapping effects when pulse width >= 10 mu s. (c) 2005 WILEY-VCH Verlag GmbH & Co.
引用
收藏
页码:841 / 845
页数:5
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