共 50 条
- [2] Thermo-mechanical Deformation in Flexible-Board Assemblies During Reflow and Post-Assembly Usage PROCEEDINGS OF THE 17TH IEEE INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS (ITHERM 2018), 2018, : 26 - 31
- [3] Warpage Measurements of Printed Circuit Board during Reflow Process Using Strain Gauges 2014 9TH INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE (IMPACT), 2014, : 397 - 400
- [5] Thermo-mechanical analyses of ITER in-vessel magnetic sensor assembly FUSION REACTOR DIAGNOSTICS, 2014, 1612 : 179 - 183
- [7] The Effect of Thermo-Mechanical Environment on the Shrinkage and Warpage in Thermoplastic Parts ADVANCED MATERIALS FORUM IV, 2008, 587-588 : 558 - 562
- [8] Prediction of transient thermo-mechanical behavior of the headstock assembly of a CNC lathe The International Journal of Advanced Manufacturing Technology, 2014, 74 : 17 - 24
- [9] Prediction of transient thermo-mechanical behavior of the headstock assembly of a CNC lathe INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY, 2014, 74 (1-4): : 17 - 24
- [10] The Thermo-Mechanical Couple Analysis Base on Assembly MATERIALS SCIENCE AND MECHANICAL ENGINEERING, 2014, 467 : 416 - 419