Thermal performance of water-cooled heat sinks: A comparison of two different designs

被引：0
|
作者：
Salem, TE [1 ]
Porschet, D [1 ]
Bayne, SB [1 ]
机构：
[1] USN Acad, Dept Elect Engn, Annapolis, MD 21402 USA
来源：
TWENTY-FIRST ANNUAL IEEE SEMICONDUCTOR THERMAL MEASUREMENT AND MANAGEMENT SYMPOSIUM, PROCEEDINGS 2005 | 2005年
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D O I：
暂无
中图分类号：
O414.1 [热力学];
学科分类号：
摘要：
As power electronic applications continue to switch higher levels of voltage and current in smaller-sized component packages, the resulting increase in power density requires efficient thermal management. This paper compares the thermal performance for operating a MOSFET on a water-cooled pole-arrayed heat sink versus a novel water-cooled microchannel heat sink. Details are presented on an innovative technique for determining the thermal capacitance modeling parameter for the heat sinks from experimental data.
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页码：264 / 269
页数：6
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