Investigation of the characteristics of overhang bonding for 3-D stacked dies in microelectronics packaging

被引：4
|
作者：
Li, Junhui [1 ,2 ]
Deng, Luhua
Ma, Bangke
Liu, Ling Gang
Wang, Fuliang
Han, Lei
机构：
[1] Cent S Univ, Sch Mech & Elect Engn, Changsha 410083, Peoples R China
[2] State Key Lab High Performance Complex Mfg, Changsha 410083, Peoples R China
来源：
MICROELECTRONICS RELIABILITY | 2011年 / 51卷 / 12期
基金：
中国国家自然科学基金;
关键词：
ALUMINUM METALLIZATION PADS; FAILURE MECHANISMS; HIGH-FREQUENCY; WIRE; TEMPERATURE; RELIABILITY; CHIPS; PART;
D O I：
10.1016/j.microrel.2011.06.005
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
It is indicated that the impact and deflection of overhang die during overhang bounding process results in considerable impact of performance of bonding in this paper. Specifically, the deflection is unstable and up to 27 mu m for the given parameters, which results in low shear force strength and low success rate of overhang bonding. To improve the performance of the overhang bonding, an effective and novel approach, overhang bonding with thick Al, is presented. The approach decreases hardness of bonding die, which makes the bonding die more compliant during bonding process than that in the traditional approach, thus the shear strength and bonding success rate of overhang bonding will be improved. Finally, effects of ultrasonic and force to overhang bonding indicates that excessively low or excessively high ultrasonic power results in weak bonding performances, and so did the force. (C) 2011 Elsevier Ltd. All rights reserved.
引用
收藏
页码：2236 / 2242
页数：7
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