THE VOIDS FORMATION IN Ni-Cu ALLOYS

被引：1

作者：

Wierzba, Bartek ^{[1
]}

Wedrychowicz, Stanislaw ^{[2
]}

Nowak, Wojciech Jerzy ^{[1
]}

Wierzba, Patrycja ^{[1
]}

Grzesik, Zbigniew ^{[3
]}

机构：

[1] Rzeszow Univ Technol, Fac Mech Engn & Aeronaut, Al Powstancow Warszawy 12, PL-35959 Rzeszow, Poland

[2] Rzeszow Univ Technol, Fac Math, Al Powstancow Warszawy 12, PL-35959 Rzeszow, Poland

[3] AGH Univ Sci & Technol, Fac Mat Sci & Ceram, Al Mickiewicza 30, PL-30059 Krakow, Poland

来源：

INTERNATIONAL JOURNAL FOR MULTISCALE COMPUTATIONAL ENGINEERING | 2017年 / 15卷 / 04期

关键词：

Kirkendall plane; voids; diffusion; mass conservation; FREE SOLDER JOINTS; DIFFUSION; FILMS;

D O I：

10.1615/IntJMultCompEng.2017020317

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

In this paper a two-dimensional model of void formation during interdiffusion is discussed. The Kirkendall and Frenkel effects are also analyzed using numerical simulations. The Kirkendall phenomenon causes the lattice shift and the voiding. The generalized Darken method along with a numerical model will be introduced. The approximation method allows for determining the evolution of voids. The model will be experimentally checked using a Ni-Cu system. It will be presented, that the voids are formed at the Matano interface and then move during the process with parabolic velocity.

引用

页码：285 / 293

页数：9

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