A Feasibility Study of Novel Packaging Technology for Low Cost and High Performance Systems

被引：0
|
作者：
Iguchi, Daisuke [1 ]
Umekawa, Hideyuki [1 ]
机构：
[1] Fuji Xerox Co Ltd, Elect Device Engn, 2274 Hongo, Ebina, Kanagawa 2430494, Japan
来源：
2014 IEEE CPMT SYMPOSIUM JAPAN (ICSJ) | 2014年
关键词：
power distribution network; power integrity; capacitor; system on chip;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
We have introduced a packaging technology utilizing high-dielectric ultra thin film between power and ground planes not as an embedded capacitor but a low impedance power distribution route directly connected to the chip. In this study the Power Distribution Network (PDN) characteristics of this structure were analyzed in detail using 3-d electromagnetic modeling in order to evaluate the feasibility of this technology. The calculated PDN impedance of the interposer used in the previous study shows good agreement with the measured impedance. Then we introduce a generic modeling technique of PDN for large scale System on Chips (SoCs) and extensive parametric study was done to determine the optimized structure and parameters for power distribution of actual SoCs.
引用
收藏
页码：118 / 121
页数：4
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