Applications of nuclear microprobes in the semiconductor industry

被引：12
|
作者：
Takai, M [1 ]
机构：
[1] OSAKA UNIV,EXTREME MAT RES CTR,TOYONAKA,OSAKA 560,JAPAN
来源：
NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH SECTION B-BEAM INTERACTIONS WITH MATERIALS AND ATOMS | 1996年 / 113卷 / 1-4期
关键词：
D O I：
10.1016/0168-583X(95)01350-4
中图分类号：
TH7 [仪器、仪表];
学科分类号：
0804 ; 080401 ; 081102 ;
摘要：
Possible nuclear microprobe applications in semiconductor industries are discussed. A unique technique using soft-error mapping and ion beam induced current measurements for reliability testing of dynamic random access memories such as soft-error immunity and noise carrier suppression has been developed for obtaining design parameters of future memory devices. Nano-probes and small installation areas are required for the use of microprobes in the semiconductor industry. Issues arising from microprobe applications such as damage induced by the probe beam are clarified.
引用
收藏
页码：330 / 335
页数：6
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